
Liquid-cooled GPU halls, direct-to-chip and immersion. We engineer the power-to-coolant interlock for 60–150 kW/rack densities.
Iron Grid owns the integration layer between power delivery and direct-to-chip or immersion cooling for 60–150 kW/rack AI data centers. Most contractors hand off at the rack PDU. We don't.

Nobody owns what happens between the CDU and the chip. That seam is where most AI deployments fail: thermal interlocks, leak detection, redundancy mismatch, controls drift.
From AI hyperscale halls to federal-clearance facilities to enterprise campus modernizations — we deliver the same co-designed seam.

Liquid-cooled GPU halls, direct-to-chip and immersion. We engineer the power-to-coolant interlock for 60–150 kW/rack densities.

Cleared work for federal AI labs and DoD compute. Buy-American compliance, controlled access, and audited handoff documentation.

Colo retrofits and on-prem AI clusters. We re-plumb power and cooling without stranding the existing white-space.
Every kilowatt that enters a rack must leave as heat in the loop within the same second. Legacy contractors treat that as two contracts. We treat it as one physical system.
We are the integration partner for Theron Energy permanent-magnet generators — 40-ft ISO-container units that drop on a pad and close the gap between utility interconnect timelines and AI compute demand.

Pre-engineered against Vertiv, Schneider, CoolIT, Motivair, and the cooling skids that actually meet AI-cluster lead times.
We work with a small number of teams at a time. Tell us your rack target, your cooling preference, and your COD. We'll come back in 48 hours with a scope.